1900 series thermal conductive adhesive
Product features
application:
1900 series thermal conductive adhesives is suitable for LED, photovoltaic, semiconductor and other electronic and electrical industries with high thermal conductivity requirements.
Features and advantages:
KINGBALI 1900 series thermal conductive adhesives have high thermal conductivity and adhesion, high material stability, slow thermal conductivity decay, and meet long-term use requirements under thermal cycling conditions.
▪ Two-component silica gel, ultra-low thermal resistance, thermal resistance ≤0.09 cm²·℃/w；
▪ Curing at room temperature, low shrinkage, meeting the process requirements of precision period；
▪ Has good water resistance；
▪ Super adhesion, saving screws；
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
EIGENVALUE
| characteristic | 1000-1900 | 1000-1901 | standard test |
| Exterior | A component: brownish red / B component: white | A component: brownish red / B component: white | Visually |
| Viscosity | A component: 300~400 Pa.S / B component: 100~200 Pa.S | A component: 150~250 Pa.S / B component: 100~200 Pa.S | ASTM D445-04 |
| proportion | A component: 2.7 g/cm3 / B component: 1.36 g/cm 3 | A component: 2.65 g/cm3 / B component: 1.36 g/cm 3 | ASTM D792 |
| Mixed ratio | A:B=1:1 (volume ratio) | A:B=1:1 (volume ratio) | / |
| Thermal Conductivity | 30 W/M·K | 30 W/M·K | ASTM-D5470 |
| Curing condition | |||
| Operating time | 3~5 Hrs（25℃） | 1~1.5 Hrs（25℃） | / |
| Full curing time | 13~30 Hrs（25℃） | 2.5~8 Hrs（25℃） | / |
| 4~10 Hrs（50℃） | 1~3 Hrs（50℃） | / | |
| 20~40 Hrs（80℃） | 15~30 Hrs（80℃） | / | |
| 10 ~ 15 min (100 ° C） | 10 ~ 15 min (100 ° C） | / | |
| Characteristics after curing (25℃/RH 70%) | |||
| hardness | ≥80 Shore D | ≥80 Shore D | ASTM D2240 |
| Tensile strength (iron/iron) | ＞200 g /cm2 | ＞200 g /cm2 | ASTM D412 |
| Thermal resistance | 0.09 cm 2 ℃ / in | 0.09 cm 2 ℃ / in | ASTM D5470 |
| Heat distortion temperature | ＞120°C | ＞120°C | ASTM D648 |
| Volume resistivity | >1010 Ω.cm | >1010 Ω.cm | ASTM D257 |
| Dielectric constant (50Hz) | 2~4 | 2~4 | ASTM D150 |
| Note: The data recorded on this website are representative values rather than guaranteed values. To improve product performance, specifications are subject to change without notice. The use of the product recorded in this website is just an example. The product can have a variety of different application scenarios and environments, which are beyond our control. Therefore, whether the product is suitable for your production process and conditions, you need to make full use of it before using it. Evaluate to confirm whether its performance and effect are in line with expectations. For applications that need to be considered safe, please test and confirm their safety in advance. In addition, the company does not guarantee that the purposes recorded on this website will not infringe any patents. Before using this product, please carefully read the explanatory text and safety data sheet (MSDS) marked on the main body of the product. This product is manufactured for general industrial applications. Do not use for medical purposes. The product may precipitate during storage. This is a normal phenomenon. Please mix well before use and strictly follow the product storage and transportation instructions. In order to obtain the best performance, the bonding surface should be clean, dry and free of grease. For high-strength structural bonds, special surface treatment can increase bond strength and durability. The material taken out of the container may be contaminated during use. Do not put the material back into the original container. Kingbali® cannot be held responsible for products that are contaminated or stored under non-instructed conditions. | |||