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9902 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 7.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Natural Sticky;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
9900 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 5.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Natural Sticky;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
● DDR Ⅱ Module/DVD Application/Hand-set Application etc.
9600 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 3.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
● Electronic Components: IC, CPU, MOS;
● LED, M/B, P/S, Heat Sink, LCD-TV, Notebook PC;
● PC, Telecom Device, Wireless Hub etc;
● DDR Ⅱ Module/DVD Application/Hand-set Application etc.
Fire-extinguishing thermal pad 900 series
Features:
● Fire-extinguishing thermal pad Ultra Soft and High Compressibility；
● 1.0~5.0 W/m.k Thermal Conductivity；Self tacky；
● Low thermal impedence；V-0 Recnogizned；
● With expansive fire-fighting capabilities；
Uses:
1710 Series thermal conductive silica gel
Features:
● 1710 Series thermal conductive silica gel with 2.0~4.5W/m.k thermal conductivity;
● Low thermal resistance;
● Low shrinkage rate, meet the process requirements of precision devices, excellent water resistance;
● High material stability, slow-speed thermla conductivity attenuation, meet the long-term use requirements under thermal cycling conditions;
Uses:
Widely used in all kinds of electronic products, such as transistors, CPU assembly, thermistor, temperature sensors, automotive electronics parts, car refrigerator, power modules, printers and so on.
4200 Series thermal double-sided tape
Features:
● Thermal double-sided tape has excellent softness,tight attaching,self-adhesive and high compression ratio;
● 0.4W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● Natural Sticky;
Uses:
● Electronic components: IC, CPU, MOS；
● LED, M/B, PS, HEAT SINK, LCD-TV, NB, PC etc;
● DDRLL Module、DVD Applications etc.
1900 Series thermal conductive adhesive glue
Features:
● Thermal conductive adhesive glue bicomponent epoxy non-solvent adhesive with low thermal resistance;
● Room temperature curable with low shrinkage, can meet the technology requirement of precision,and have apreferable waterproof;
● Thermal conductive adhesive glue with strong adhesion and do not need screw;
● High stability and slow in thermal conductivity, can be long-term use under the condition of meet the need of thermal cycle.
Uses:
Thermal conductive adhesive glue apply in COB, photovoltaic, semiconductor and other electronic and electric industry which have a higher request about the thermal conductivity.
High strength thermal silicone pad
Features:
● 0.8~1.0 W/m.k Thermal Conductivity；Self tacky；
● Low thermal impedence；V-0 Recnogizned；
● Ultra Soft and High Compressibility；
● With expansive fire-fighting capabilities；
Uses:
Features:
● Thermal grease with low oil departure degree;
● Excellent thermal conductivity;
● Thermal grease with electrical insulation;
● High temperature resistance;
● Thermal grease with low consistency and good construction performance;
Uses:
Features:
● Low viscosity, good leveling, suitable for complex electronic parts and LED potting;
● After curing good toughness, good impact resistance;It has excellent moisture, water effect;
● Plus forming, and heat curing at room temperature;
Uses:
9400 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 2.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9500 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 2.5 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9800 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 4.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
Uses:
9901 Series thermal conductive pad
Features:
● Ultra Soft and High Compressibility;
● 6.0 W/m.k Thermal Conductivity;
● Low Thermal Impedance;
● UL94 V0 Recognized;
● Natural Sticky;
Uses:
Features:
2600N series of natural graphite is a natural mineral, generally formed in high temperature geological conditions, widely distributed in metamorphic deposits, by rich in organic matter or carbon sedimentary rock by regional deterioration.
Uses:
Features:
▪ thermal conductivity is 1000-1900 W/M.K;
▪ flexible flakes, can be processed into a variety of shapes, good bending performance;
▪ density is 1.6-2.1 g/cm3 (approximately 1/3-3/4 of aluminum or 1/5-1/4 of copper);
▪ low resistance for electromagnetic shielding;
Uses:
1301 Single-component thermal adhesive
Features:
▪ thermal conductivity: 1.0 W/M.K;
▪ de-alcohol type;
▪ table drying time is short;
▪ vulcanization is non-corrosive to metals;
▪ thermal conductivity, fixed, moisture-proof, shock-proof, insulation and other effects and can withstand the impact of hot and cold changes;
Uses:
Features:
▪ low viscosity, good leveling, suitable for complex electronic accessories and LED potting;
▪ the toughness after curing is good, the impact resistance is good;
▪ heat resistance, moisture resistance, cold resistance is excellent, after application can extend the life of electronic accessories;
▪ plus molding, can be cured at room temperature and heating;
▪ has excellent moisture and water resistance.
Uses:
Features:
▪ has low oil separation, high and low temperature, water, ozone, climate aging;
▪ can be used for a long time at temperatures of -40℃ - 150℃;
▪ thermal grease has excellent thermal conductivity, electrical insulation, stability of use, low consistency and good construction performance.
Uses:
1900 series thermal conductive adhesive
Features:
▪ Two-component silica gel, ultra-low thermal resistance, thermal resistance ≤0.09 cm²·℃/w；
▪ Curing at room temperature, low shrinkage, meeting the process requirements of precision period；
▪ Has good water resistance；
▪ Super adhesion, saving screws；
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
1740 series two-component silicone gel
Features:
▪ Low thermal resistance;
▪ Excellent environmental resistance;
▪ Low shrinkage, meeting process requirements during precision period, and having good water resistance;
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
1710 series one-component thermal conductive silicone gel
Features:
▪ 8.0 W/M.K thermal conductivity;
▪ low thermal resistance;
▪ Low shrinkage;
▪ Satisfy the process requirements of the precision period, and have good water resistance;
▪ High material stability, slow thermal conductivity decay, meeting the long-term use requirements under thermal cycling conditions.
Uses:
Thermal conductivity silica gel sheet (1~ 15W)
Features:
▪ Soft, good compressibility;
▪ 1 ~ 15.6 W/M.K thermal conductivity;
▪ Low thermal resistance;
▪ Fire rating reaches UL-94 V0.
Uses:
Features:
1000-1900W/m.k thermal conductivity;High efficiency of heat transfer;
Light weight, Easy Processing ;[Details]
Uses:
9700 Series Thermal Conductive Pad
Features:
Ultra Soft and High Compressibility, Low Thermal Impedance, UL94 V0 Recognized;
3.5 W/m.k；
Uses: